YS COMPANY LIMITED
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Place of Origin:
China
Brand Name:
YS Precision
Certification:
ISO9001
Model Number:
Custom CNC Machining
Semiconductor equipment relies on precision mechanical structures that require stable dimensions, accurate interfaces, and consistent manufacturing quality.
This project involved manufacturing a CNC machined 6061-T6 aluminum frame plate used in a semiconductor equipment application.
The component was produced according to the customer's 3D CAD model and 2D engineering drawings. Unlike a standard aluminum plate, this part contains multiple machined pockets, internal openings, mounting holes, and reference surfaces that work together as an integrated equipment structure.
Manufactured from 6061-T6 aluminum, the frame plate has an approximate size of 390 × 290 mm and requires critical hole accuracy within ±0.05 mm.
After precision CNC machining, the components received natural anodizing without sand blasting to maintain a clean aluminum surface finish while providing additional corrosion protection.
The finished parts were inspected and shipped to Israel for semiconductor equipment integration.
| Item | Details |
| Part Type | Semiconductor Equipment Frame Plate |
| Application | Semiconductor Equipment |
| Material | 6061-T6 Aluminum |
| Size | Approx. 390 × 290 mm |
| Quantity | Approx. 10 pcs |
| Manufacturing Process | Precision CNC Milling |
| Critical Hole Accuracy | ±0.05 mm |
| Surface Finish | Natural Anodizing |
| Drawing Source | Customer 3D Model + 2D Drawing |
| Export Market | Israel |
6061-T6 aluminum is widely used for semiconductor and precision equipment components because it offers a practical balance between:
For this frame plate, the challenge was not simply machining individual features, but maintaining the relationship between multiple functional areas across a relatively large aluminum component.
The part includes:
These features require careful CNC process planning to maintain the final assembly requirements.
Although the overall shape appears like a plate structure, this type of component requires more attention than conventional CNC milling parts.
With a size of approximately 390 × 290 mm, removing a significant amount of material can influence the stability of the component.
During machining, the process was optimized to reduce the influence of:
The goal was to maintain stable geometry throughout the machining process.
The frame plate contains multiple recessed areas and internal structures designed around the semiconductor equipment layout.
These machined areas require:
The process was developed to balance machining efficiency with dimensional accuracy.
The mounting holes and connection features serve as interfaces with other equipment modules.
Critical hole positions were controlled within:
±0.05 mm
Inspection focused not only on individual hole sizes but also on:
After CNC machining, the frame plates received:
Natural Anodizing
The customer selected this finish without sand blasting to maintain the original machined aluminum appearance.
The anodizing process provides:
For precision equipment components, surface finishing needs to be considered together with machining because coating processes can influence final dimensions and surface characteristics.
For complex aluminum structural components, successful manufacturing often starts before machining begins.
After receiving the customer's CAD data and drawings, the engineering team reviewed:
This review helps identify potential manufacturing risks and allows the machining process to be planned around the final equipment requirements.
Semiconductor equipment manufacturers often require specialized components in limited quantities during equipment development, upgrades, or customized machine production.
This project required a small production quantity, but the manufacturing requirements were closer to production standards rather than simple prototypes.
The focus was on:
This type of work requires a manufacturing partner who understands both engineering requirements and production consistency.
For semiconductor equipment parts, dimensional accuracy and surface condition are critical.
The inspection process included:
After anodizing, the components were carefully packaged to protect the finished aluminum surfaces during international transportation.
Semiconductor equipment components often require a different level of manufacturing control compared with general industrial parts.
For this frame plate, the key requirement was not only achieving individual dimensions on the drawing, but ensuring that multiple machined areas functioned together as a complete structural component.
From engineering review to CNC process planning, machining, surface finishing, and inspection, every step was coordinated around:
This project represents the type of precision aluminum machining work required by equipment manufacturers developing advanced industrial systems.
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