YS COMPANY LIMITED
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Place of Origin:
China
Brand Name:
YS Precision
Certification:
ISO9001
Model Number:
Custom CNC Machining
Semiconductor equipment requires mechanical components with high dimensional stability, accurate interfaces, and consistent machining quality.
This project involved manufacturing a custom CNC machined aluminum chamber body used in a semiconductor equipment system.
The component was manufactured from 6061-T6 aluminum based on the customer's 3D CAD model and 2D engineering drawings.
Unlike standard CNC machined housings, this chamber body contains:
The part size is approximately 390 × 290 mm. After precision CNC milling, the components received clear anodizing (natural anodizing) and were inspected before shipment to Israel.
| Item | Details |
| Component | Semiconductor Equipment Chamber Body |
| Material | 6061-T6 Aluminum |
| Manufacturing Process | CNC Milling |
| Size | Approx. 390 × 290 mm |
| Quantity | Approx. 10 sets |
| Critical Features | Precision machined interfaces |
| Surface Treatment | Clear Anodizing |
| Production Type | Low-volume precision manufacturing |
| Market | Israel |
For semiconductor equipment, aluminum structural components are often required to combine:
This chamber body required more than machining the external profile.
The critical requirement was maintaining the relationship between:
During CNC process planning, machining sequence and workholding methods were considered carefully to maintain stability throughout production.
The main feature of this component is the large internal cavity structure.
Deep cavity aluminum machining requires careful control because:
The manufacturing process was developed around:
This approach helps maintain the geometry required for semiconductor equipment assembly.
6061-T6 aluminum is widely used for semiconductor equipment mechanical components because it offers:
For this chamber body, the customer selected:
Clear Anodizing (Natural Anodizing)
The finish provides:
Because anodizing can influence surface characteristics, finishing requirements were considered during the CNC machining stage.
Semiconductor equipment companies often design highly customized mechanical structures that cannot be produced from standard components.
This chamber body was manufactured from:
Before machining, engineering review focused on:
The goal was to ensure the machining process matched the equipment design intent.
Many semiconductor equipment projects require limited quantities of specialized mechanical parts.
These components are not typical mass-production parts. They require:
This type of manufacturing supports:
For semiconductor equipment mechanical parts, quality depends on both dimensional accuracy and surface condition.
Inspection includes:
After clear anodizing, the chamber bodies were carefully protected and packaged for international shipment.
Producing semiconductor equipment components requires a combination of machining capability and engineering understanding.
For this chamber body project, the key manufacturing challenges were:
This type of project represents the precision aluminum machining capability required by semiconductor equipment manufacturers and industrial technology companies.
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